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InterNiche Technologies is a Campbell, CA-based company in the Computers and Electronics sector.
A K Microsystems is a Richmond Hill, ON-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Sourcetone Technology is a Whitehall, PA-based company in the Computers and Electronics sector.
Arctic Sand was founded in 2011 to bring game changing power conversion semiconductors to market, based on technology developed by MIT. Our products offer significant improvements in power conversion efficiency, transient performance and EMI, in footprints 2-4x smaller than the best in class competitors today and with a significantly lower profile, enabling smaller, thinner, lighter and more power efficient products to be realized. Our initial product roadmap is focused on power conversion for LED display backlighting and microprocessors for mobile applications such as smartphones, tablets and Ultrabooks. Our technology is highly flexible and will soon be applied to broader applications such as Servers, Storage and Networking, and integrated within processors and ASICs.