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Luminus Devices develops and manufactures products that enable illumination applications around the world. Patented, high performance Luminus LEDs are the brightest and most versatile solid state light sources available today, redefining the solid state lighting landscape by enabling the adoption of LED technology into emerging markets. Luminus technology is used in commercial and industrial lighting fixtures, theatrical lighting, projectors, signs, medical equipment, UV curing… just about anywhere a bright, efficient, reliable, long-life light source is needed.
Revasum (pronounced re vôsəm) (“re” is for removal and “vasum” is Latin for equipment) is a new company headquartered in San Luis Obispo, California, providing premiere CMP and grinding technology to critical growth markets such as power, RF communications, LED, MEMS, and other mobile applications. Our mission is built on a design philosophy of investing in new product development that is specifically targeted at these global markets, with the purpose of meeting the unique needs of the device makers in this high-tech space. Revasum offers new and certified refurbished systems for sale worldwide.
Tokyo Electron America is a Austin, TX-based company in the Computers and Electronics sector.
Aspera Corp is a Ames, IA-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.