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Ann's Hallmark is a Anaheim, CA-based company in the Computers and Electronics sector.
Lifetime Memory Products is a Irvine, CA-based company in the Computers and Electronics sector.
Sequans Communications is a leading developer and supplier of single-mode LTE chipset solutions that are highly cost and power efficient. Sequans was founded in 2003 to address the WiMAX market where it became the de facto leader in WiMAX chips, and in 2009 turned to address the LTE market, where today its LTE chips are powering many new single-mode LTE devices, including tablets, routers, and M2M solutions. Sequans is one of the most experienced pure-play 4G technology companies in the world, having developed and delivered six generations of steadily advancing 4G technology.
Z-Communications, Inc. is a leading provider of VCO (voltage-controlled oscillators) and PLL (phase-locked loop) modules for the commercial RF and Wireless markets. With over 700 off-the-shelf products ranging from 40MHz to 10GHz bands, Z-Communications
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.