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Akustica is a Pittsburgh, PA-based company in the Computers and Electronics sector.
Easic provides the ability to innovate and create differentiated products based on customized silicon devices. eASIC's unique Single Mask Adaptable ASIC devices dramatically reduce overall cost, time-to-production and power consumption while increasing performance. eASIC offers a comprehensive product portfolio to meet the most demanding needs whether it be performance, cost, power or time-to-market.
Redaptive makes buildings more efficient one saved kilowatt hour at a time. We are breaking down the barriers to portfolio-wide energy efficiency deployments through our Efficiency-as-a-Service (EaaS) platform – empowering companies to optimize their real estate portfolios and save millions on their energy bills. Our EaaS platform builds the foundation for future investments in both resource efficiency and smart building innovation. Founded in 2014, Redaptive manages a national portfolio of energy efficiency projects across 30+ states for leading F500 companies like, McKesson and Aramark, among others. Redaptive has received funding from CBRE, the world`s largest commercial real estate services and investment firm, ENGIE, a global energy player, GXP Investments, the venture capital arm of Great Plains Energy Incorporated, and Linse Capital, a Silicon Valley-based growth capital firm. Redaptive is headquartered in San Francisco, California and has offices in Denver, Colorado and Pune, India. Our creative team of business and technology experts is at the core of our success in delivering a groundbreaking platform to accelerate energy efficiency adoption.
i3 Electronics, Inc. (i3) is a world class supplier of electronic interconnect solutions. Effective vertical integration differentiates us from any supplier in the electronics industry. We are experts in the fabrication and assembly of ultra high-end printed circuit boards and back planes, advanced flip chip and wire bond semiconductor packaging and integration. We also provide services that complement these offerings; advanced assembly, design and layout, thermal, electrical and mechanical modeling, signal integrity, reliability and environmental testing and physical analysis. Our solutions deliver leading edge technology and best-in-class quality, performance and reliability and are available at any stage of the product life cycle. While uncommon, this offers our clients perfect and seamless extendability from prototype, pre-production and production phases without the headache of shifting facilities, processes and support personnel. i3 product lines support the needs of the defense & aerospace, industrial, telecommunications, high performance computing, semiconductor, alternative energy, and medical markets where highly reliable products built in robust manufacturing operations are critical to success.
We are the backbone of microwave. Lowest profile, lightest weight K to V/W-band backplanes and modules for satcom, phased arrays, and sensors. SSPAs, time delay, wideband antennas, AESA feeds, transceivers. Get the most out of GaN MMICs: waveguide performance without the bulk and expense of machining. Creators of the revolutionary PolyStrata(R) architecture.