What Happened?
Chandler, AZ-based Amkor Technology has Promoted Choon Heung Lee as Chief Technology Officer
About the Company
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
About the Person
Choon Heung Lee has been the Chief Technology Officer and Executive Vice President of Amkor Technology, Inc. since December 10, 2013. Dr. Lee joined Amkor in 1996 and has served in various senior management positions during his time with the company, including most recently as Corporate Vice President, Business and Technology Management. Dr. Lee also has written 23 research papers on various packaging technology related subjects and has been granted 26 patents in Korea and 11 in the US. He holds a degree in physics and a Masters degree in statistical physics from Korea University, and a Masters degree and Ph.D. in physics from Case Western Reserve University.
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