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Sidense Corp., founded in 2004, is a leading developer of silicon-proven, embedded non-volatile memory (NVM) intellectual property (IP). Sidense`s patented 1T-Fuse™-based one-transistor one-time programmable (1T-OTP) memory enables a wide range of electronic products that are built with complex System-on-Chip (SoC) semiconductors. End-market products include home entertainment consumer products, cellular telephones and other mobile communications devices, configurable processors, RFID, medical, industrial, automotive and a host of others. Semiconductor and systems companies integrate Sidense 1T-OTP IP macros into their SoC designs, saving time and money and allowing them to focus on the core competencies that differentiate their products. Sidense provides memory IP that is difficult and uneconomical for the device makers to try to create on their own. Important requirements of Sidense customers include the need to incorporate NVM that can be manufactured on a standard-logic CMOS process with no additional masks or process steps, is field-programmable, has a very small footprint, very fast read access times, is extremely difficult to reverse engineer, and has very low operating and standby power consumption. Sidense is the only supplier of antifuse 1T-OTP IP that can meet all of these demanding requirements at the leading semiconductor foundries from 180nm to 20nm, with development underway at smaller geometries.
OAI is a San Jose, CA-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Sierra Peaks is a Albuquerque, NM-based company in the Computers and Electronics sector.
Kool Chip is a San Jose, CA-based company in the Computers and Electronics sector.