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Peraso is a fabless semiconductor company specializing in the development of integrated circuits for the 60 GHz wireless marketplace. Peraso`s goal is to provide best in class products for the consumer electronics (CE) market in general, and specifically to the mobile segment, including smartphones, tablets, and digital cameras. As such, Peraso endeavors to incorporate features critical to the mobile market in our products, including minimal footprint, low power consumption and competitive price points. Peraso offers exciting new challenges in a dynamic entrepreneurial environment.
Beta Squared Inc is a Allen, TX-based company in the Computers and Electronics sector.
First Nano is a Carpinteria, CA-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Nova Measuring Instruments Ltd. is a leading provider of advanced, high-throughput metrology solutions for semiconductor manufacturing worldwide. Used by over 80% of the largest integrated-circuit manufacturers, Nova’s solutions deliver the high-volume complex measurements required for effective process control. Nova offers a selection of Integrated and Stand-Alone metrology platforms, which are complimented by the powerful NovaMARS® modeling engine. This flexible offering enables Nova to partner with semiconductor manufacturers throughout the entire product lifecycle; from application development to high-volume production. Featuring a unique combination of Spectroscopic Reflectrometry and Scatterometry, Nova’s metrology solutions measure a wide variety of features and parameters including CD, trench depth, photoresist height, thickness and shape of complex layer stacks. With Nova, you get the tight wafer-to-wafer and within-wafer control necessary to develop and produce advanced 2D/3D structures for high-end semiconductor devices. Founded in 1993, Nova’s headquarters are located in Israel and the company has offices in Taiwan, Korea, Singapore, China, United States, Japan and Europe.