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Halo Industries is a company that creates novel laser-based hardware systems for materials fabrication that help manufacturers drastically reduce waste, improve quality, and enable next-generation technologies.
At Cree, we`re always on. We believe that meaningful change happens through sheer force of will and the determination of a team solving a problem, and we`re unafraid to kick down the door to make it happen. That`s how we inspired the LED revolution and continue to create brilliantly affordable, radically simple, uncompromisingly efficient solutions that transform the way we experience light. From inventing America`s best-selling light bulb to commercializing the brightest lighting-class LEDs, our vision isn`t just to cultivate a thriving business – it`s to better the world. And we don`t take no for an answer. Be part of what`s next. Our growing multi-billion dollar start-up is impressing the biggest names in tech. Join one of Fast Company`s The World`s 50 Most Innovative Companies 2015 and a 2014 MIT Technology Review “50 Smartest Company.” Let`s revolutionize energy efficiency and transform the way we experience light.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
LVX Systems is a Saint Cloud, MN-based company in the Computers and Electronics sector.
Magnum offers a complete set of chips, software, reference platforms, and engineering support for digital video recording, playback and management of audio/video content. The Magnum platforms also enable sharing entertainment via optical disc, flash disk