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Ero Spirit Research Institute is a Oakland, CA-based company in the Computers and Electronics sector.
Integrated Device Technology, Inc., founded in 1980, delivers system-level innovations that optimize customers` applications and enrich the end-user experience. Over the years, IDT`s customer base has demanded that the industry reevaluate mixed-signal integrated circuit products — IDT rose to accept that challenge. IDT continues to build on its No. 1 positions in timing, serial switching and memory interfaces to expand its mixed-signal content in Communications, Computing and Consumer applications, driven by three major market drivers including cloud computing, consumer mobility and 4G/LTE. The company`s product portfolio has become a fusion of analog and system expertise as well as traditional digital competencies, providing customers with complete application-optimized mixed-signal solutions. The IDT 30+ year heritage and innovation in digital technologies, coupled with its in-house analog talents and capabilities, make IDT the premier analog and digital company. Headquartered in San Jose, California, IDT has design, manufacturing and sales facilities throughout the world. IDT stock is traded on the NASDAQ Global Select Stock Market® under the symbol “IDTI.”
MediaTek is a pioneering fabless semiconductor company, and a market leader in cutting-edge systems on a chip for wireless communications, HDTV, DVD and Blu-ray. MediaTek created the world's first octa-core smartphone platform with LTE and our CorePilot technology released the full power of multi-core mobile processors. MediaTek is headquartered in Taiwan and has offices worldwide.
Spencer Industries Inc is a Belleville, NJ-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.