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General Cable, a Fortune 500 company, has been a wire and cable innovator for over 170 years. With more than 14,500 associates, we are one of the largest wire and cable manufacturers in the world. General Cable`s Global Vision is to be the most highly regarded and successful wire and cable company in the world and to operate in every major geographic market. The Company`s Operating Philosophy is to act with the speed and agility of a small company but with the strength and the power of a large company.
Trek is a Medina, NY-based company in the Computers and Electronics sector.
ASE Test Limited (ASE Test) is an independent semiconductor testing company, providing a range of testing services. These services include front-end engineering testing at its facilities in the Silicon Valley area in California, Austin, Texas and Taiwan,
Alphawave is a semiconductor IP company focused on providing DSP based, multi-standard connectivity Silicon IP solutions targeting both data processing in the Datacenter and data generation by IoT end devices. Alphawave`s vision is to make the integration of complex DSP based mixed-signal IPs, simple, reliable and cost-effective for the semiconductor industry. Alphawave is led by well-known industry veterans and world-class mixed-signal researchers. Alphawave is headquartered in Toronto, Canada, with a global footprint in China, Europe, Korea, and the United Kingdom.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.