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Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
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We are a technology leader focused on unleashing the potential of data so that we can fulfill our mission: Create world-changing technology that enriches the lives of every person on earth` That is our purpose, our ultimate motivation and why we exist` We are in the midst of an exciting journey to go beyond just PCs and servers to a company that is at the center of a new era where everything looks and acts like a computer` The explosion of devices and data has led to several technology inflections—AI, 5G network transformation, and the rise of the intelligent edge—that, together, will shape the future of technology` Whether it’s using AI to stop illegal poaching or engineering greater safety into autonomous vehicles, our innovations help solve global challenges` Yet, our work is far from done.