| Name | Title | Contact Details |
|---|---|---|
Alexander Neff |
Sr. Director Information Security | Profile |
Biowatch Medical Inc (Main) is a Columbia, SC-based company in the Healthcare, Pharmaceuticals, and Biotech sector.
Schick Technologies is a Long Island City, NY-based company in the Healthcare, Pharmaceuticals, and Biotech sector.
The Argen Corporation is the world`s largest manufacturer of precious dental gold alloys, leader in zirconia manufacturing, and leading innovator of digital dentistry solutions and scrap refining services. With more than 50 years serving the dental industry, Argen now distributes to more than 100 countries with subsidiaries in Canada, China, Germany and the United Kingdom. Argen enables dental labs of all sizes to integrate digital into every aspect of their workflow by offering a wide range of digitally-produced products and services. Argen is proud to be a family-owned American company that manufactures the highest quality products in the US and is dedicated to treating customers like family.
Reeves-Sain is one of the leading companies in the Healthcare, Pharmaceuticals, and Biotech sector.
Promex, located in Silicon Valley, is an ISO 13485:2003 Medical and ISO 9001:2008 certified microelectronics, semiconductor & advanced packaging and high reliability SMT/PCBA contract assembly service provider for the medical & bioscience, commercial and military markets. Core competencies allow the sequential steps of prototypes, new product introductions & beta production, followed by volume manufacturing. Complete in-house microelectronics process capabilities and process expertise uniquely integrates SMT / PCBA with microelectronics assembly. Facilities include Class 100 and Class 1000 clean rooms, RoHS optimized SMT/PCBA lines, plus development & assembly areas. ISO 13485 Medical process verification and validation using IQ, OQ, PQ and pFMEA practices and extensive use of statistical process controls. Complete Microelectronics Assembly Process Flows: • Wafer handling and sawing including 300 mm wafers • Fully automatic die attach • Wire bonding (Au ball, Al wedge, RF ribbon & wedge, Cu) • Plastic over molding (multi-chip modules, arrays, system-in-package) • Precision materials dispense • Encapsulation • Flip Chip High Reliability SMT/PCBA and Chip-on-Substrate: RoHS optimized SMT lines allow single facility process integration. Leaded solder processing also available. Chip-on-Substrate expertise. IPC-A-610 Class 3 assembly. Consigned and full turnkey SMT/PCBA and supply chain management. Quality Systems (Medical): FDA Title 21 Part 820 compliance ensures device history files, operator training records, IQ, OQ, PQ and process documentation meet all standards.