| Name | Title | Contact Details |
|---|
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Metrospec Technology is a Saint Paul, MN-based company in the Computers and Electronics sector.
Easic provides the ability to innovate and create differentiated products based on customized silicon devices. eASIC's unique Single Mask Adaptable ASIC devices dramatically reduce overall cost, time-to-production and power consumption while increasing performance. eASIC offers a comprehensive product portfolio to meet the most demanding needs whether it be performance, cost, power or time-to-market.
Micro Component Technology is a Saint Paul, MN-based company in the Computers and Electronics sector.
MediaTek is a pioneering fabless semiconductor company, and a market leader in cutting-edge systems on a chip for wireless communications, HDTV, DVD and Blu-ray. MediaTek created the world's first octa-core smartphone platform with LTE and our CorePilot technology released the full power of multi-core mobile processors. MediaTek is headquartered in Taiwan and has offices worldwide.