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Microvision Optical, Inc is a San Diego, CA-based company in the Healthcare, Pharmaceuticals, and Biotech sector.
ResMed (NYSE: RMD, ASX: RMD), a world-leading connected health company with more than 4 million cloud-connected devices for daily remote patient monitoring, changes lives with every breath. Its award-winning devices and software solutions help treat and manage sleep apnea, chronic obstructive pulmonary disease and other respiratory conditions. Its 6,000-member team strives to improve patients’ quality of life, reduce the impact of chronic disease and save healthcare costs in more than 120 countries.
Valeritas is committed to developing and commercializing innovative treatment solutions that contribute to clinical and humanistic outcomes for patients, with an initial focus on the treatment of Type 2 diabetes. Valeritas` portfolio is headlined by the V-Go® disposable insulin delivery device, which is being commercialized and reimbursed in a specialty pharmaceutical model and is distributed through retail pharmacy.
Maxant Technologies is a Niles, IL-based company in the Healthcare, Pharmaceuticals, and Biotech sector.
Promex, located in Silicon Valley, is an ISO 13485:2003 Medical and ISO 9001:2008 certified microelectronics, semiconductor & advanced packaging and high reliability SMT/PCBA contract assembly service provider for the medical & bioscience, commercial and military markets. Core competencies allow the sequential steps of prototypes, new product introductions & beta production, followed by volume manufacturing. Complete in-house microelectronics process capabilities and process expertise uniquely integrates SMT / PCBA with microelectronics assembly. Facilities include Class 100 and Class 1000 clean rooms, RoHS optimized SMT/PCBA lines, plus development & assembly areas. ISO 13485 Medical process verification and validation using IQ, OQ, PQ and pFMEA practices and extensive use of statistical process controls. Complete Microelectronics Assembly Process Flows: • Wafer handling and sawing including 300 mm wafers • Fully automatic die attach • Wire bonding (Au ball, Al wedge, RF ribbon & wedge, Cu) • Plastic over molding (multi-chip modules, arrays, system-in-package) • Precision materials dispense • Encapsulation • Flip Chip High Reliability SMT/PCBA and Chip-on-Substrate: RoHS optimized SMT lines allow single facility process integration. Leaded solder processing also available. Chip-on-Substrate expertise. IPC-A-610 Class 3 assembly. Consigned and full turnkey SMT/PCBA and supply chain management. Quality Systems (Medical): FDA Title 21 Part 820 compliance ensures device history files, operator training records, IQ, OQ, PQ and process documentation meet all standards.