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A long career in IT followed. In 1996, he moved to Dow Corning, a parent company of HSC, where he held various roles in IT and Supply Chain and traveled the world as part of Dow Corning`s Global Automation Team. He left shortly after Dow bought out Dow Corning in 2016 and returned to HSC as its IT manager in 2017. He has been HSC`s director of IT since August 2018.
High Performance Test is a Fremont, CA-based company in the Computers and Electronics sector.
Sidense Corp., founded in 2004, is a leading developer of silicon-proven, embedded non-volatile memory (NVM) intellectual property (IP). Sidense`s patented 1T-Fuse™-based one-transistor one-time programmable (1T-OTP) memory enables a wide range of electronic products that are built with complex System-on-Chip (SoC) semiconductors. End-market products include home entertainment consumer products, cellular telephones and other mobile communications devices, configurable processors, RFID, medical, industrial, automotive and a host of others. Semiconductor and systems companies integrate Sidense 1T-OTP IP macros into their SoC designs, saving time and money and allowing them to focus on the core competencies that differentiate their products. Sidense provides memory IP that is difficult and uneconomical for the device makers to try to create on their own. Important requirements of Sidense customers include the need to incorporate NVM that can be manufactured on a standard-logic CMOS process with no additional masks or process steps, is field-programmable, has a very small footprint, very fast read access times, is extremely difficult to reverse engineer, and has very low operating and standby power consumption. Sidense is the only supplier of antifuse 1T-OTP IP that can meet all of these demanding requirements at the leading semiconductor foundries from 180nm to 20nm, with development underway at smaller geometries.
Wolverine Trading LP is a Chicago, IL-based company in the Computers and Electronics sector.
A Silicon Photonics start up focusing on photonic Sensor and 3D imaging applications.