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AMSC generates the ideas, technologies and solutions that meet the world`s demand for smarter, cleaner … better energy. Through its Windtec Solutions, AMSC provides wind turbine electronic controls and systems, designs and engineering services that reduce the cost of wind energy. Through its Gridtec Solutions, AMSC provides the engineering planning services and advanced grid systems that optimize network reliability, efficiency and performance. The company`s solutions are now powering gigawatts of renewable energy globally and enhancing the performance and reliability of power networks in more than a dozen countries. Founded in 1987, AMSC (American Superconductor) is headquartered near Boston, Massachusetts with operations in Asia, Australia, Europe and North America.
Unigen Corporation is a Fremont, CA-based company in the Computers and Electronics sector.
Our mission is to drive the future of edge computing with our FPGA silicon platforms. At the heart of our FPGAs is our disruptive Quantum™ fabric, which delivers a big Power-Performance-Area advantage over traditional FPGA technologies. Trion® FPGAs, offering 4K to 120K logic elements (LEs), have a small form factor, low power, are priced for high-volume production, and are available now in volume quantities. Taking it to the next level, Trion Titanium FPGAs have an enhanced Quantum compute fabric combined with a 16 nm process to give even lower power and higher speeds. With densities ranging from 25K LEs to 500K LEs, Titanium FPGAs are ready to meet your next design challenge. With their Power-Performance-Area advantage, Trion and Trion Titanium FPGAs address applications such as custom logic, compute acceleration, machine learning, and deep learning.
AGCO Printed Circuitry is a Woodland Park, CO-based company in the Computers and Electronics sector.
Irvine Sensors Corporation (ISC), headquartered in Costa Mesa, California, is a vision systems company engaged in the development and sale of miniaturized infrared and electro-optical cameras, ultra high speed image processors, 3D laser imaging systems, and stacked chip assemblies.