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Corning Frequency Control Inc is a Mount Holly Springs, PA-based company in the Computers and Electronics sector.
Copper Clad Multilayer Pdts is a Anaheim, CA-based company in the Computers and Electronics sector.
UMD Technology is a Vancouver, WA-based company in the Computers and Electronics sector.
InvenSense, A TDK Group company, is a world leading provider of MEMS sensor platforms found in Mobile, Wearables, Smart Home, Industrial, and Automotive products. The companys patented Fabrication Platform, MotionFusion® technology, audio solutions, and location software and services addresses the emerging need of many mass-market consumer applications via improved performance, accuracy, and intuitive motion, gesture and sound-based interfaces. In May of 2017, InvenSense became part of the MEMS Sensors Business Group within the newly formed Sensor Systems Business Company of TDK Corporation. TDK currently focuses on three market segments: automotive, industrial equipment & energy, and information & communications technology (ICT). As part of its strategy for growth in these key areas, TDK has identified sensors and actuators, energy units and next-generation electronic components as three product areas for strategic growth aimed at unlocking new business opportunities in the sphere of the Internet of Things (IoT). Sensors are viewed as an important IoT-enabling technology, and sensor products and the technology portfolio of TDK will expand dramatically as a result of its acquisition of InvenSense. TDK InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia and Italy.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.