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Woof is an app designed to protect the wellbeing of your pets if youre involved in an incident and cant come home to them – bringing you peace of mind anytime you leave your pets at home alone. Woof utilizes geolocation and a three-tiered support system to keep your pets safe if you dont return home by your pre-set timeframe (Away Timer). Woof uses a "set it and forget it" model and works completely in the background. Once you create your account and set your Away Timer, you dont need to enter the the app again unless you want to change or disable your Away Timer.
HomeX is a first-of-its-kind home services platform for both homeowners and service providers, designed to radically improve the complex and fragmented home services industry. Providing quick, trusted solutions for heating, cooling, plumbing, electrical, and appliance issues, HomeX is simplifying maintenance and troubleshooting for homeowners.
Ayr Strategies Inc.is a vertically integrated multi-state operator in the U.S. cannabis sector, with an initial anchor portfolio in Massachusetts and Nevada. Through its five operating companies, Ayr is a leading cultivator, manufacturer and retailer of cannabis products and branded cannabis packaged goods.
Aegis Brands owns and operates Bridgehead Coffee and Hemisphere Cannabis Co. The Company`s vision is to build a portfolio of amazing brands that can grow and flourish with access to our resources and expertise. The Company is committed to letting each brand operate independently while providing shared expertise to help them thrive.
Xperi Corporation (Nasdaq: XPER) and its wholly owned subsidiaries, DTS, FotoNation, Invensas and Tessera, are dedicated to creating innovative technology solutions that enable extraordinary experiences for people around the world. Xperi`s solutions are licensed by hundreds of leading global partners and have shipped in billions of products in areas including premium audio, broadcast, computational imaging, computer vision, mobile computing and communications, memory, data storage, and 3D semiconductor interconnect and packaging.