| Name | Title | Contact Details |
|---|---|---|
Homer Antoniadis |
Chief Technology Officer | Profile |
Electronic Marketing Assoc. is a Raleigh, NC-based company in the Computers and Electronics sector.
Copy Pro Inc is a Concord, CA-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Our mission is to drive the future of edge computing with our FPGA silicon platforms. At the heart of our FPGAs is our disruptive Quantum™ fabric, which delivers a big Power-Performance-Area advantage over traditional FPGA technologies. Trion® FPGAs, offering 4K to 120K logic elements (LEs), have a small form factor, low power, are priced for high-volume production, and are available now in volume quantities. Taking it to the next level, Trion Titanium FPGAs have an enhanced Quantum compute fabric combined with a 16 nm process to give even lower power and higher speeds. With densities ranging from 25K LEs to 500K LEs, Titanium FPGAs are ready to meet your next design challenge. With their Power-Performance-Area advantage, Trion and Trion Titanium FPGAs address applications such as custom logic, compute acceleration, machine learning, and deep learning.
Heateflex Corporation specializes in gas and liquid temperature control applications for the semiconductor, life science, food and beverage, and other precision process industries. The company offers a broad range of customizable, high-purity equipment for heating and cooling fluids and gases, including chemical heaters, deionized water heaters, gas heaters, steam heaters and heat exchangers. These applications are able to control temperature with precision and efficiency, and are adaptable to the specific needs of individual customer applications. The company maintains patents in over 17 technologies, and continuously develops next-generation tools for its target industry segments.