| Name | Title | Contact Details |
|---|---|---|
Nicholas Griffith |
Chief Technology Officer | Profile |
Intrapack Industries Inc is a Dallas, TX-based company in the Computers and Electronics sector.
Eyelit is the leader in Manufacturing Execution, Quality Management (MES and QMS), and Automation solutions for visibility, control, and coordination of manufacturing operations for the aerospace & defense, battery technology, electronics, life sciences, medical device, semiconductor, battery, and solar industries. Eyelit uniquely delivers a broad set of smart factory and Industry 4.0 solutions, including Asset Management, Dispatching, Factory and Equipment Integration (Automation/IoT), Manufacturing Execution (MES/MOM), Recipe Management, Supply Chain Management, Quality Management (CAPA/OCAP/SPC/APC/RMA), and Business Process Management, that enable its customers to rapidly and cost-effectively optimize production and company processes. With exceptional customer service, Eyelit has time and again proven that superior, innovative technology can increase efficiency and value. More than 50 leading companies, including Atomica, austriamicrosystems, CEA-Leti, eMagin, Enovix, LFoundry, Murata Electronics Oy, Northrop Grumman Corporation, NXP Semiconductors, PerkinElmer, Raytheon Technologies, Skyworks Solutions, TowerJazz, and multiple global 50 companies, rely on Eyelit as a trusted software partner.
Wisair is a Campbell, CA-based company in the Computers and Electronics sector.
Nova Semiconductor is a San Jose, CA-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.