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Production Line Testers is a Pleasanton, CA-based company in the Computers and Electronics sector.
Untether AI is a company that provides ultra efficient, high performance AI chips to enable new frontiers in AI applications. Their groundbreaking at memory architecture provides unrivaled compute density, accelerating AI inference for diverse neural n...
By harnessing sunshine to produce steam, GlassPoint helps industry leaders reduce their carbon emissions at the lowest possible cost. GlassPoint designed its enclosed trough technology specifically to address the needs of industrial users, especially those operating in remote and harsh environments. Enclosed trough technology has been deployed at scale in multiple projects in California and the Middle East.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
AppliedMicro is a global leader in energy conscious computing and connectivity solutions for telco, enterprise, data center, consumer and SMB applications. With a 30-year heritage as an innovator in high-speed connectivity and high performance embedded processing, AppliedMicro employs patented transport and embedded processor SoCs to provide high performance energy efficient products. AppliedMicro`s corporate headquarters are located in Sunnyvale, California. Sales and engineering offices are located throughout the world.