| Name | Title | Contact Details |
|---|---|---|
Matt Spradley |
Chief Technology Officer | Profile |
Joel Odelson |
Chief Information Security Officer | Profile |
Cara Bilinski |
Executive Director, IT PMO | Profile |
Saline Electronics is a Saline, MI-based company in the Computers and Electronics sector.
Monterey Bay Communications is a Santa Cruz, CA-based company in the Computers and Electronics sector.
ArterisIP provides Network-on-Chip interconnect IP to SoC makers so they can reduce cycle time, increase margins, and easily add functionality. Unlike traditional solutions, Arteris’ plug-and-play technology is flexible and efficient, allowing designers to optimize for throughput, power, latency and floorplan. Using ArterisIP solves pain for our customers. Traditional bus and crossbar interconnect approaches create serious problems for architects, digital and physical designers, and integrators: Massive numbers of wires, increased heat and power consumption, failed timing closure, spaghetti-like routing congestion leading to increased die area, and difficulty making changes for derivatives. ArterisIP NoC IP reduces the number of wires down to one half, results in fewer gates, fewer and shorter wires, and a more compact chip floor plan. Having the option to configure each connection’s width, and each transaction’s dynamic priority assures meeting latency and bandwidth requirements. And with the Arteris IP configuration tool suite, design and verification can be done easily, in a matter of days or even hours. Arteris invented NoC technology, offering the first commercial solution in 2006, and is now the choice for many major semiconductor manufacturers including TI, NEC and others. Between tapeouts, production projects and benchmarks, ArterisIP has shipped in over 100 SoCs.
Infiniti Solutions is a Santa Clara, CA-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.