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Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
BPM Microsystems is a Houston, TX-based company in the Computers and Electronics sector.
EIT LLC (Electronic Instrumentation and Technology) was founded in 1977 with the belief that our customers would benefit if we supported our manufacturing team with a strong engineering team. Considered revolutionary in 1977, this belief and approach continues to guide us today. We’ve changed and evolved, and will continue to do so as technology changes, but we will remain committed to supporting our customers’ needs with a strong engineering team. EIT provides Electronic Manufacturing & Engineering Services for customers in the medical, communications, industrial process control, analytical instrument and defense markets. EIT’s niche is working with a high mix of medium to high technology assemblies. EIT has the resources to support customer requirements from low to high quantities. Low (including prototypes) to medium volumes can be manufactured in one of multiple Virginia facilities or our latest facility in New England. EIT is also able to support high volume manufacturing requirements in low cost region (LCR). EIT measures many of our relationships with customers in tens of years instead of in business quarters or months. A long term relationship with a customer allows EIT to invest in our customer, improve product quality and achieve cost reductions to benefit the customer
eSys Distribution is a Glendale Heights, IL-based company in the Computers and Electronics sector.
Tier Logic is a Santa Clara, CA-based company in the Computers and Electronics sector.