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Pliops was founded in 2017 by flash storage industry veterans from Samsung, M-Systems and XtremIO. Pliops is creating a new category of product that enables cloud and enterprise data centers to access data up to 50X faster with 1/10th of the computational load and power consumption. Its technology collapses multiple inefficient layers into one ultra-fast device based on a groundbreaking patent-pending approach. Pliops` solution solves the scalability challenges raised by the cloud data explosion and the increasing data requirements of AI and ML applications.
Since its founding in 1963, TEL has grown to encompass many offices around the world that engineer, manufacture, sell, and service wafer-processing or semiconductor production equipment (SPE), as well as flat panel display (FPD) and thin-film silicon photovoltaic equipment (PVE). As the world market share leader in several product lines, TEL plays a key role in the evolving global semiconductor industry.
Glonav is a Newport Beach, CA-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Innovative Circuits Arizona is a Gilbert, AZ-based company in the Computers and Electronics sector.