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Faced with the exponential growth of data, Alphawave IP`s technology services a critical need: enabling data to travel faster, more reliably and with higher performance at lower power. Alphawave IP is a global leader in high-speed connectivity for the world`s technology infrastructure. Our IP and silicon solutions therefore meet the needs of global tier-one customers in data centers, compute, networking, AI, 5G, autonomous vehicles, and storage. Founded in Toronto, Canada in 2017, by an expert technical team with a proven track record in licensing semiconductor IP, our mission is to focus on the hardest-to-solve connectivity challenges.
ViXS Systems, Inc. is a Toronto, ON-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Redefined Ultra-Low-Power, Full System-on-Chip Solutions PsiKick develops next generation ultra-low-power wireless sensing systems with the lowest-power sensing devices in the world. Fully integrated and silicon-proven, the system-on-chip solutions operate at up to 1/1,000th the power of existing best-in-class "low power" solutions. Their extreme energy efficiency enables them to be powered without a battery from a variety of harvested energy modalities including vibration, thermal gradients, solar, RF, or piezo actuation.
Engent is a Norcross, GA-based company in the Computers and Electronics sector.