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Cresco Labs is a recognized leader in the U.S. cannabis industry through experienced management, access to capital and a demonstrated growth strategy. As a differentiated grower, processor and retailer of premium cannabis with operations in six states (Illinois, Ohio, Pennsylvania, Nevada, California and Arizona), the company focuses on entering markets with outsized demand potential, significant supply constraints and high barriers to entry. Its unparalleled speed-to-market gives Cresco a distinct competitive advantage as it replicates its model to expand its national footprint. The company has a core value of normalizing and professionalizing the cannabis industry. Cresco`s proven ability to execute is complemented by a well-defined brand strategy that is tailored to all major consumer segments: everyday cannabis, medicinally focused, connoisseur grade, and chef inspired edibles by James Beard Award-winning pastry chef Mindy Segal.
Implus is home to more than 20 brands in the footwear accessories, hosiery, specialty running, outdoor, fitness and medical categories. As an industry leader in fitness and footwear accessories, Implus is committed to helping people live healthy and active lives, providing innovative products to more than 80,000 retail outlets and in 70 countries around the world. Implus is headquartered in Durham, North Carolina. Key brands within Implus` portfolio include SKLZ®, TriggerPoint™, Balega®, Harbinger®, RockTape®, Sof Sole®, Spenco® and Yaktrax®.
Our vision is to be a global cannabis leader focused on providing branded cannabis products backed by science and innovation.
Xperi Corporation (Nasdaq: XPER) and its wholly owned subsidiaries, DTS, FotoNation, Invensas and Tessera, are dedicated to creating innovative technology solutions that enable extraordinary experiences for people around the world. Xperi`s solutions are licensed by hundreds of leading global partners and have shipped in billions of products in areas including premium audio, broadcast, computational imaging, computer vision, mobile computing and communications, memory, data storage, and 3D semiconductor interconnect and packaging.