Vitesse Semiconductor is a fabless supplier of high-performance integrated circuits (ICs), application software and integrated turnkey systems solutions used primarily in Carrier, Enterprise and industrial Internet of Things (IoT) network applications. With its corporate DNA in Carrier service provider networking, Vitesse has historically focused on both Carrier and Enterprise networking, selling into many of the leading OEMs that service these markets. Today, Vitesse is a leading supplier of ICs for next-generation Ethernet-based Carrier, Enterprise, and IoT networks worldwide. We design, develop and market a diverse portfolio of high-performance, feature-rich, low-power and cost-competitive Ethernet networking and connectivity IC solutions, associated applications and protocol software. For over 30 years, Vitesse has been a leading innovator in networking and connectivity solutions, leading adoption of new technologies in Carrier and Enterprise networking. Many of the technologies Vitesse developed for Carrier and Enterprise networking are highly synergistic in emerging adjacent markets, such as the industrial Internet of Things (IoT), automotive, storage and other networks converging on Ethernet. Vitesse continues leading the forefront to enable diverse networking industries to make the transition from legacy to standards-based, ubiquitous "Ethernet Everywhere" networking.
Urban Grid is a utility scale renewable energy project developer, with over a decade of expertise in taking solar and energy storage projects through the full development process, from site acquisition through interconnection, permitting, offtake execution and project exit. Headquartered in Richmond, Virginia–with teams located strategically throughout the United States, Urban Grid has provided utilities and corporate clients with reliable clean energy. We are actively developing a growing portfolio of approximately 13,000 megawatts of solar PV and 7,000 megawatts of co-located and stand-alone energy storage, throughout 12 states in support of America`s transition to clean, sustainable power.
Surge Components is a Deer Park, NY-based company in the Computers and Electronics sector.
CMC Materials, Inc., headquartered in Aurora, Illinois, is a leading global supplier of consumable materials primarily to semiconductor manufacturers. The company`s products play a critical role in the production of advanced semiconductor devices, helping to enable the manufacture of smaller, faster and more complex devices by its customers. CMC Materials, Inc. is also a leading provider of performance materials to pipeline operators. The company`s mission is to create value by delivering high-performing and innovative solutions that solve its customers` challenges. The company has approximately 2,200 employees globally.
Sidense Corp., founded in 2004, is a leading developer of silicon-proven, embedded non-volatile memory (NVM) intellectual property (IP). Sidense`s patented 1T-Fuse™-based one-transistor one-time programmable (1T-OTP) memory enables a wide range of electronic products that are built with complex System-on-Chip (SoC) semiconductors. End-market products include home entertainment consumer products, cellular telephones and other mobile communications devices, configurable processors, RFID, medical, industrial, automotive and a host of others. Semiconductor and systems companies integrate Sidense 1T-OTP IP macros into their SoC designs, saving time and money and allowing them to focus on the core competencies that differentiate their products. Sidense provides memory IP that is difficult and uneconomical for the device makers to try to create on their own. Important requirements of Sidense customers include the need to incorporate NVM that can be manufactured on a standard-logic CMOS process with no additional masks or process steps, is field-programmable, has a very small footprint, very fast read access times, is extremely difficult to reverse engineer, and has very low operating and standby power consumption. Sidense is the only supplier of antifuse 1T-OTP IP that can meet all of these demanding requirements at the leading semiconductor foundries from 180nm to 20nm, with development underway at smaller geometries.