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A privately held company incorporated in July 1997, Tensilica is known as the leader and major innovator in configurable processor technology, with multiple patents on its easy-to-use automated processor design systems
Delphon`s mission is to provide materials and services for the shipping, processing, printing, and packaging of high value technology and medical components. Headquartered in Hayward, California, CEO Jeanne Beacham has aggressively positioned Delphon to take advantage of changes within the industries the company serves. With divisions Gel-Pak, TouchMark and UltraTape along with a worldwide sales and distribution network, Delphon Industries serves a wide range of markets.
AVAILINK is a Germantown, MD-based company in the Computers and Electronics sector.
Advancement in hi-definition display technologies is changing the way professional AV equipment is being used to communicate, broadcast, interact, collaborate & advertise in commercial environments. While this trend has fueled exponential growth in the professional audio/video (pro-AV) market, the rapid change in consumer electronics technologies driving this growth continues to outpace the technical innovation in complementary technologies required for AV signal processing & distribution systems which form the backbone of most AV installations. A Montreal-based company, AptoVision provides advanced chipsets for AV/KVM signal extension, matrix switching, IP-based switching, video-wall and multi-view applications. Enabling end-to-end systems, these chipsets also integrate advanced inline signal processing capabilities such as light compression, broadcast quality scaling and audio down-mixing. In 2014, AptoVision introduced its award-winning BlueRiver NT technology which forever changed the face of AV signal distribution by allowing installers and OEMs to replace traditional AV matrix switches with IP switches while delivering noticeably higher price/performance, flexibility and scalability.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.