| Name | Title | Contact Details |
|---|
A privately held company incorporated in July 1997, Tensilica is known as the leader and major innovator in configurable processor technology, with multiple patents on its easy-to-use automated processor design systems
A long career in IT followed. In 1996, he moved to Dow Corning, a parent company of HSC, where he held various roles in IT and Supply Chain and traveled the world as part of Dow Corning`s Global Automation Team. He left shortly after Dow bought out Dow Corning in 2016 and returned to HSC as its IT manager in 2017. He has been HSC`s director of IT since August 2018.
Fuji Electric Corp. of America is a Edison, NJ-based company in the Computers and Electronics sector.
High Speed Design Center is a Santa Clara, CA-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.