| Name | Title | Contact Details |
|---|
Complete Automation is a Lake Orion, MI-based company in the Computers and Electronics sector.
Siliconaire is a Sunnyvale, CA-based company in the Computers and Electronics sector.
Redaptive makes buildings more efficient one saved kilowatt hour at a time. We are breaking down the barriers to portfolio-wide energy efficiency deployments through our Efficiency-as-a-Service (EaaS) platform – empowering companies to optimize their real estate portfolios and save millions on their energy bills. Our EaaS platform builds the foundation for future investments in both resource efficiency and smart building innovation. Founded in 2014, Redaptive manages a national portfolio of energy efficiency projects across 30+ states for leading F500 companies like, McKesson and Aramark, among others. Redaptive has received funding from CBRE, the world`s largest commercial real estate services and investment firm, ENGIE, a global energy player, GXP Investments, the venture capital arm of Great Plains Energy Incorporated, and Linse Capital, a Silicon Valley-based growth capital firm. Redaptive is headquartered in San Francisco, California and has offices in Denver, Colorado and Pune, India. Our creative team of business and technology experts is at the core of our success in delivering a groundbreaking platform to accelerate energy efficiency adoption.
Advanced SaaS platform for Microgrid and distributed energy system design and operation optimization. #microgrid #distributedenergy #microgrids #DER #resilientinfrastructure #evcharging The XENDEE software platform is built atop hundreds of millions of dollars of US government R&D carried out over the past decade at the US national laboratories, most notably Lawrence Berkeley National Laboratory, and validated both in the laboratory and projects in cooperation with Arizona State University, University of California San Diego, utilities and the Electric Power Research Institute (EPRI).
Absolics Inc. provides glass substrates with built-in active and passive elements that offer high performance, low power consumption, and form factor to high-performance computing (HPC) related packaging companies, data centers, and AI.