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UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC`s robust foundry solutions allow chip designers to leverage the company`s leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies to enable specialized applications such as IoT and wearable, sensing, MEMS, automotive, PMIC and CIS. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction has been completed for Phases 5&6, with future plans for Phases 7&8. UMC`s total manufacturing capacity exceeds 500,000 8-inch equivalent wafers per month, providing ample supply for our global customer base. The company serves its worldwide customers through offices in Taiwan, mainland China, Europe, Japan, Korea, Singapore, and the United States.
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Ossia is challenging people`s core assumptions about what is possible with wireless power. Ossia`s flagship product, Cota®, redefines wireless power by safely delivering remote, targeted energy to devices at a distance. Cota, Ossia`s patented smart antenna technology automatically keeps multiple devices charged without any user intervention, enabling an efficient and truly wire-free, powered-up world, that is always on and always connected.