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Advanced SaaS platform for Microgrid and distributed energy system design and operation optimization. #microgrid #distributedenergy #microgrids #DER #resilientinfrastructure #evcharging The XENDEE software platform is built atop hundreds of millions of dollars of US government R&D carried out over the past decade at the US national laboratories, most notably Lawrence Berkeley National Laboratory, and validated both in the laboratory and projects in cooperation with Arizona State University, University of California San Diego, utilities and the Electric Power Research Institute (EPRI).
Uhnder develops disruptive products for sensing, cognition, and communication.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Cornell Dubilier has actively pursued various means of communication to make it as easy as possible for our customers to do business with us. In addition to the standard telephone, fax, and email, we have implemented an EDI system. We have also
Our mission is to drive the future of edge computing with our FPGA silicon platforms. At the heart of our FPGAs is our disruptive Quantum™ fabric, which delivers a big Power-Performance-Area advantage over traditional FPGA technologies. Trion® FPGAs, offering 4K to 120K logic elements (LEs), have a small form factor, low power, are priced for high-volume production, and are available now in volume quantities. Taking it to the next level, Trion Titanium FPGAs have an enhanced Quantum compute fabric combined with a 16 nm process to give even lower power and higher speeds. With densities ranging from 25K LEs to 500K LEs, Titanium FPGAs are ready to meet your next design challenge. With their Power-Performance-Area advantage, Trion and Trion Titanium FPGAs address applications such as custom logic, compute acceleration, machine learning, and deep learning.