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NexTech Solutions is a San Mateo, CA-based company in the Computers and Electronics sector.
Pliops was founded in 2017 by flash storage industry veterans from Samsung, M-Systems and XtremIO. Pliops is creating a new category of product that enables cloud and enterprise data centers to access data up to 50X faster with 1/10th of the computational load and power consumption. Its technology collapses multiple inefficient layers into one ultra-fast device based on a groundbreaking patent-pending approach. Pliops` solution solves the scalability challenges raised by the cloud data explosion and the increasing data requirements of AI and ML applications.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Fisher and Williams, Plc is a Manchester, TN-based company in the Computers and Electronics sector.
Empower Semiconductor was founded to solve fundamental problems in power delivery for data-intensive applications. Traditional power solutions require dozens of discrete components with big footprints, complex designs and deliver power inefficiently with poor response times and inaccuracies. Empower`s patented IVR technology integrates dozens of components into a single IC increasing efficiency, shrinking footprints by 10x and delivering power with unprecedented simplicity, speed & accuracy and with zero discrete components. The Empower Semi IVR technology addresses a wide range of applications including data centers, AI, mobile, 5G, and IoT. The company is based in Milpitas, CA and is led by a team of highly experienced power experts and executives.