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Acorn Technologies develops foundational building blocks for designing today`s advanced semiconductors and systems. With a special focus on wireless communications and mobile computing, the company offers a unique portfolio of patent-protected and licensable IP cores and scalable semiconductor process technologies that enable significantly better IC and system performance, processing power, speed and throughput. Acorn helps semiconductor manufacturers and chip design companies overcome technology bottlenecks to achieve their performance goals for advanced ICs used in next-generation devices. The company also serves the telecommunications system developer with IP cores, algorithms and other IP solutions for mobile, computing and wireless networking, helping them to address the demanding needs of an increasingly connected world.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Edwards is a leading developer and manufacturer of sophisticated vacuum products, abatement solutions and related value-added services. Our products are integral to manufacturing processes for semiconductors, flat panel displays, LEDs and solar cells; are used within an increasingly diverse range of industrial processes including power, glass and other coating applications, steel and other metallurgy, pharmaceutical and chemical; and for both scientific instruments and a wide range of R&D applications. Edwards is part of the Atlas Copco Group
Texas Home Place is a Castroville, TX-based company in the Computers and Electronics sector.
MaxLinear, Inc. is a provider of integrated radio-frequency (RF) analog and mixed-signal semiconductor solutions for broadband communications applications. The Company?s RF receiver products capture and process digital and analog broadband signals to be