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Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Cavendish Kinetics is a San Jose, CA-based company in the Computers and Electronics sector.
OmniVision Technologies, Inc. is one of the leading companies in the Computers and Electronics sector.
Robson Technologies is a Morgan Hill, CA-based company in the Computers and Electronics sector.
Founded in 2014 by experienced industry leaders and scientists from University of California at Santa Barbara (UCSB) and Cornell University, Akoustis` mission is to commercialize and manufacture its patent-pending Bulk ONE™ acoustic wave technology to address the critical frequency-selectivity requirements in today`s mobile smartphones – improving the efficiency and signal quality of Mobile Wireless devices and enabling The Internet of Things. The Bulk Acoustic Wave (BAW) filter market is rapidly expanding, driven by growth in 4G/LTE and the number of filters required per device. Nearly 2 billion mobile phones are manufactured per year, and over half are in the growing segment of high-end smartphones. Because these smartphones need to operate globally, on more than one carrier, and with bands that are becoming ever-closer together, the need for higher-performance filters is upon us to ensure mobile compatibility. 4G/LTE networks are driving the need for higher frequencies, and traditional SAW filters simply cannot provide the necessary coverage and performance, as evidenced by the growing mix of BAW filters in the mobile phone. Akoustis™ addresses this critical mobile-wireless need by using single crystal piezoelectric materials to create a new class of acoustic wave filters – improving performance, lowering cost and driving miniaturization. Akoustis` Bulk ONE™ filters originate from materials which exhibit 30% better acoustic performance when compared to the incumbent thin-film technologies deployed today. Akoustis` business model is capital efficient, which leverages decades of cap-x investments in the semiconductor industry. Founded in 2014, Akoustis™ is located in the piedmont technology corridor between Charlotte and Raleigh.