| Name | Title | Contact Details |
|---|
Silicon Labs is a leading provider of silicon, software and solutions for a smarter, more connected world. Our award-winning technologies are shaping the future of the Internet of Things, Internet infrastructure, industrial automation, consumer and automotive markets. Headquartered in Austin, Silicon Labs has more than 1,400 team members in over 20 countries creating products focused on performance, energy savings, connectivity and simplicity. We`re passionate about what we do and are proud that the Global Semiconductor Alliance voted us the Most Respected Public Semiconductor company for three of the last four years.
Founded in 1995, Marvell Technology Group Ltd. has operations worldwide and more than 7,000 employees. Marvell’s U.S. operating subsidiary is based in Santa Clara, California and Marvell has international design centers located in China, Europe, Hong Kong, India, Israel, Japan, Malaysia, Singapore, Taiwan and the U.S. A leading fabless semiconductor company, Marvell ships over one billion chips a year. Marvell’s expertise in microprocessor architecture and digital signal processing, drives multiple platforms including high volume storage solutions, mobile and wireless, networking, consumer and green products. World class engineering and mixed-signal design expertise helps Marvell deliver critical building blocks to its customers, giving them the competitive edge to succeed in today’s dynamic market.
Tokyo Electron America is a Austin, TX-based company in the Computers and Electronics sector.
Cookson Electronics - Semiconductor Products is a Suwanee, GA-based company in the Computers and Electronics sector.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.