| Name | Title | Contact Details |
|---|---|---|
Michael Andrews |
CTO GPI Global Product Innovation | Profile |
Ramu Duvur |
Senior Director of Information Security and Risk Management | Profile |
Kannan Perumal |
Chief Information Security Officer | Profile |
Kannan Perumal |
Vice President, Chief Information Security Officer | Profile |
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
Palma Ceia SemiDesign (PCS) is a fabless semiconductor company and leading provider of communication semiconductors and IP for next-generation Wi-Fi and cellular applications. With a focus on emerging Wi-Fi and LTE standards, particularly for IoT (Internet of Things), PCS targets the design of ICs for broadband, wireless, medical, and automotive applications. Palma Ceia SemiDesign solutions are differentiated by low power, high performance, and ease of integration. Headquartered in the Cayman Islands, the company has design and sales support centers in Cambridge (United Kingdom), mainland China, Hong Kong, and McKinney, Texas (United States). PCS is soon expanding to provide direct support for Israel, Japan, Korea, and Taiwan.
Arasan Chip Systems is a San Jose, CA-based company in the Computers and Electronics sector.
Panta systems Inc. is a Cupertino, CA-based company in the Computers and Electronics sector.
Advance Probe is a San Jose, CA-based company in the Computers and Electronics sector.