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i3 Electronics, Inc. (i3) is a world class supplier of electronic interconnect solutions. Effective vertical integration differentiates us from any supplier in the electronics industry. We are experts in the fabrication and assembly of ultra high-end printed circuit boards and back planes, advanced flip chip and wire bond semiconductor packaging and integration. We also provide services that complement these offerings; advanced assembly, design and layout, thermal, electrical and mechanical modeling, signal integrity, reliability and environmental testing and physical analysis. Our solutions deliver leading edge technology and best-in-class quality, performance and reliability and are available at any stage of the product life cycle. While uncommon, this offers our clients perfect and seamless extendability from prototype, pre-production and production phases without the headache of shifting facilities, processes and support personnel. i3 product lines support the needs of the defense & aerospace, industrial, telecommunications, high performance computing, semiconductor, alternative energy, and medical markets where highly reliable products built in robust manufacturing operations are critical to success.
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Lam Research Corp. (NASDAQ:LRCX) is a trusted global supplier of innovative semiconductor manufacturing equipment and services to the world’s leading chipmakers. Lam’s advanced process technology is transforming the way semiconductor devices are made, with atomic-scale features that are more than 1,000 times smaller than a grain of sand. We collaborate with customers to help them build smaller, faster, and more power-efficient devices that drive technology into everyday life. Lam focuses on solid product performance and value, continuous innovation, and a values-based culture that delivers on its commitments. It is why nearly every chip today is built with Lam technology.