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JDSU serves markets that are at the heart of what’s important, making virtually every network in the world faster and more reliable. JDSU leads the fastest-growing segments of the optical-networking market: tunable XFPs, transport blades, and reconfigurable optical add/drop multiplexers (ROADMs). From development and planning, through deployment and turn-up testing, to optimization and assurance, JDSU test instruments, software, and expertise ensure that all networks—xDSL, fiber, cable, and wireless—are always working at their best. JDSU also applies its sophisticated optical technologies to a range of markets that use light to achieve a unique purpose, from fighting counterfeiting and protecting consumer brands to enabling satellites.
Amkor Technology, Inc. is one of the world`s largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test, and is now a strategic manufacturing partner for more than 250 of the world`s leading semiconductor companies, foundries and electronics OEMs. Amkor`s operational base includes 10 million square feet of floor space with production facilities, product development centers, and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the U.S. Amkor offers a suite of services, including package design and development, wafer probe and package test, wafer bumping and redistribution services, assembly and final test. The availability of high quality packaging and test services allows our customers to focus their resources on semiconductor design and wafer fabrication while engaging with Amkor as their technology innovator in packaging and test solutions. Amkor `s packaging formats include wafer level, CSP, BGA, leadframe and the enablement of next generation 3D packaging solutions. Amkor has introduced several state-of-the-art package formats including advanced copper pillar bumping, Through Mold Via (TMV®), Through Silicon Via (TSV), and Wafer Level Fan-Out (WLFO). 3D configurations such as Package-on-Package, stacked CSP and BGA, as well as die stacks that integrate all manner of flip chip and wire bond interconnect showcase Amkor leadership in continuous technology innovation.
VORAGO Technologies is a privately held, fabless semiconductor company based in Austin, TX with patented and proven solutions that remove the limitations of both radiation and extreme temperature-related failures inherent in traditional technology. VORAGO’s patented HARDSIL® technology can be integrated into the standard silicon manufacturing process to enable components to withstand the most extreme conditions, including temperatures beyond 200°C, while providing exceptional longevity. VORAGO’s microcontroller products are based on HARDSIL and are well suited for automotive, industrial, military / aerospace and networking applications.
Neocera is a Beltsville, MD-based company in the Computers and Electronics sector.
Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the aerospace, automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets. Skyworks is a global company with engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America and is a member of the S&P 500® and Nasdaq-100® market indices (NASDAQ: SWKS).